Thick SUEX® TDFS
Thick SUEX® TDFS are photo imageable epoxy sheets for plating, wafer-level packaging, and MEMS applications. The sheets consist of a catatonically cured modified epoxy photoresist between two throw-away layers of protective polyester film (PET).
Material Features:
- It contains an antimony-free photoacid generator and is prepared under a highly controlled solvent-less process, which provides uniform coatings
- This solvent-developed negative working photoresist is sensitive to UV radiation in the range of 350–395nm
- Thick SUEX® TDFS is compatible with/exhibits good adhesion to silicon, silicon nitride, copper, gold, aluminum, glass, polymers, other metals, and oxides
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