SIPOL – A new Si-containing thermal nanoimprint resist series for the fabrication of high aspect ratio patterns.
SIPOL is typically applied in a bilayer system, i.e. in combination with an underlying organic transfer layer like UL1 for example. This approach renders the fabrication of high aspect ratio patterns by an amplification of the imprinted relief of the SIPOL layer into the underlying organic transfer layer and in the substrate material by applying a sequence of consecutive plasma etch processes. In special cases or if required, SIPOL can also be applied as a single resist layer.
Product Features:
SIPOL – A new Si-containing thermal nanoimprint resist series for the fabrication of high aspect ratio patterns.
SIPOL is typically applied in a bilayer system, i.e. in combination with an underlying organic transfer layer like UL1 for example. This approach renders the fabrication of high aspect ratio patterns by an amplification of the imprinted relief of the SIPOL layer into the underlying organic transfer layer and in the substrate material by applying a sequence of consecutive plasma etch processes. In special cases or if required, SIPOL can also be applied as a single resist layer.