AUROELECTROLESS™ SMT Immersion Gold
AUROLECTROLESS™ SMT Immersion Gold is designed to produce a uniform fine-grained deposit of soft pure gold on metallic substrates like copper, nickel and palladium.
Material Features:
- Exhibits excellent pH stability and has high tolerance to metallic contamination
- The deposits are solderable and when applied over nickel are also aluminium wire-bondable
Manufacturer:
