Solderon BT-64
Solderon BT-64 is a low foaming electroplating process for the high speed deposition of bright 60/40 tin-lead alloys from a non-fluoroborate electrolyte.
The process is distinguished by its low foaming character, minimizing the problem of poor definition caused by stable cathodic foam in controlled depth selective electro-deposition.
Solderon BT-64 is designed for use in the high speed reel to reel selective electroplating of connector components. Deposits produced have excellent solderability and pass the Military Specification 202F.
Manufacturer:
